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MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 1 of 23 tfr / 02.08.2013 rev 01 5 features microcontroller: mlx16x8 risc cpu o 16 bit risc-cpu o co-processor for fast multiplication and division o in-circuit debug and emulation memories o 32 kbyte flash with ecc o 2 kbyte ram o 384 byte eeprom with ecc for customer purpose supported bus interface o lin-interface with integrated lin transceiver supp orting lin 2.x and sae j2602, certified lin protocol software provided by melexis o in-module-programming (flash and ee) via pin lin u sing a special melexis fast protocol o pwm-interface o full duplex spi, master/slave, double-buffered, sp eed programmable voltage regulator o internal voltage regulator, direct powered from 12 v battery supply o operating voltage vs = 5.5v to 18v, ic will work d own to 3.9v o possibility to put an external bypass transistor f or high temperature requirements o very low sleep mode current < 30ua, wake up by lin traffic or local sources periphery o 4 programmable 16bit pwm modules for external tran sistor full bridge applications o timer unit 16 bit with 4 capture and 4 compare o 25 mhz +/-5% internal rc-oscillator with pll, opti onal crystal resonator o load dump and brown out interrupt function o digital watchdog for software flow tracking o system-clock-independent fully integrated watchdog o on-chip temperature sensor with +/-10k accuracy o 10 bit adc with < 6 s conversion time with multip le channels and different adc references, dma access to ram o 8 multiple purpose i/os o 2 integrated relay drivers with free wheel functio n o 2 inputs for relay contact or shunt current monito ring o over current detection, shunt current sense o 1 switch-able supply output for external hall sen sor connection additional features o direct access to pin lin possible o temperature range -40c up to 150c ambient, aec-q1 00 grade 0 qualified o 28v jump start and 45v load dump protected o monolithic solution: single chip in single package realization o small qfn32 5x5 and tqfpep48 7x7 package applications lin slaves for all kind of high current dc an d 1 / 2 phase bldc motor control, like o window lifter o sun roof o dc oil, water and fuel pumps o throttle valves o automatic head lean o dc/dc converters
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 2 of 23 tfr / 02.08.2013 rev 01 5 ordering information order code [1] temp. range package delivery remark MLX81150 llq-xaa-000-tu -40 - 150 c qfn32 5x5 tube MLX81150 llq-xaa-000-re -40 - 150 c qfn32 5x5 reel MLX81150 lpf-xaa-000-tr -40 - 150 c tqfp ep 48 7x7 tray MLX81150 lpf-xaa-000-re -40 - 150 c tqfp ep 48 7x7 reel table 1 C ordering information [1] .see marking/order code.
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 3 of 23 tfr / 02.08.2013 rev 01 5 contents 1. functional diagram ................................. ................................................... .................................... 4 2. pin description .................................... ................................................... ........................................... 5 3. electrical characteristics......................... ................................................... ............................ 7 3.1 o perating conditions ................................................... ................................................... ............... 7 3.2 a bsolute maximum ratings ................................................... ................................................... ....... 8 4. application examples............................... ................................................... ................................. 10 4.1 s ingle dc motor drive ................................................... ................................................... ........... 10 4.2 s ingle dc motor drive with soft start / stop ................................................... ......................... 11 4.3 s ingle dc motor drive in fet controlled full bridge applications ........................................ 12 4.4 led-l amp driver , switch mode power supply ................................................... .......................... 13 4.5 MLX81150 in 1- and 2- phase bldc ( brush less dc) m otor control applications ................. 14 4.6 h igher vdda loads or higher ambient temperatures ................................................... ............ 15 4.7 u se of external resonator ................................................... ................................................... ... 15 4.8 k ey inputs with different wetting currents in active and sleep configuration .................... 16 5. mechanical specification ........................... ................................................... ............................. 19 5.1 p ackage data qfn32 (5 x 5, 32 leads ).................................................. ......................................... 19 5.2 p ackage data tqfp e p 48l (7 x 7, 48 leads ).................................................. ................................ 20 6. marking/order code ................................. ................................................... ................................. 21 6.1 m arking MLX81150 ........................................... ................................................... ......................... 21 6.2 o rder c ode MLX81150........................................... ................................................... ................... 21 7. assembly information............................... ................................................... ................................ 22 8. disclaimer......................................... ................................................... .............................................. 23
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 4 of 23 tfr / 02.08.2013 rev 01 5 1. functional diagram (dma) vs vddd lin gndl ti1 ti2 to rel1 rel2 vdda ad1 key7 key1 key2 key3 key4 gnda ps vs ps vdda / vaux vddd isense temp key7 key6 key5 key4 key3 key2 key1 key0 osc1 osc2 pwm1 rtg key5 key6 pwm2 tc1 tc2 sense1 sense2 relcon1 relcon2 osci1 relcon1 gndh f main vs clamp key0 gndd vs clamp vs clamp pwma pwmb pwmc pwmd osc1 osc2 f main relcon2 osci2 osci1 osci2 pwm_din1 pwm_din2 pwm_din1 pwm_din2 adc figure 1- block diagram
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 5 of 23 tfr / 02.08.2013 rev 01 5 2. pin description pin no. qfn32 pin no. tqfp48 pad count pin name voltage range remarks and description 30 44 1 vs pwr hv battery supply voltage; external protection against reverse polarity needed, external blocking capacitors 29 43 2 gndd pwr ground pin for digital part 27 40 2 gnda pwr ground pin for analogue part 12 17 2 gndh pwr ground pin for relay driver 15 21 1 gndl pwr ground pin for lin 25 38 2 vdda pwr lv regulator output (~3.3 v), exte rnal blocking capacitors 28 42 2 vddd pwr lv regulator output (~1.8 v), ext ernal blocking capacitors 26 39 1 rtg ana lv output for external bipolar tran sistor in case of ht applications 32 47 1 ps ana hv high-side switch with ron < 40 oh m at 20ma, switch-able supply (<15 v) for external components [3:10] [4:11] 8 key[7:0] multi- function hv high voltage i/o port with wake-up function, input for high or low active switches, adc input, low-side driver output 4ma (15ma), weak current sources for pin diagnosis and wake up in sleep mode spi interface pins (valid for key[3:0], di, do, clk , cs) 31 45 1 ad1 ana hv high voltage adc input (for vbat measurement), low side driver 30 ua (only for test purposes) 13, 11 18, 16 2, 2 rel[2:1] ana hv low-side switch with ron < 7 ohm at 150 ma @150c, relay driver with free wheel function, pwm controlled output 23, 24 35, 36 2 sense[2:1] ana hv high voltage inpu t for read out the status of relay contacts, current sense function for shunt current 2, 1 2, 1 2 pwm[2:1] ana hv push pull output with r on < 50 ohm at 20ma, high output level is supply related but max approx. 14v, pwm controlled output 21, 22 32, 33 2 tc[2:1] ana lv input for timer capt ure unit, low voltage input 18, 19 27, 28 2 osc[2:1] ana lv crystal oscillator pin, low voltage input, load capacitors external, a dc input 14 20 1 lin ana hv lin 2.x transceiver bus pin, sl ave only, high voltage i/o 17, 16 26, 25 1 ti[2:1] dig input test inputs for m elexis, debug interface - connect via resistor to gnd in application mode, so that flashing via these tes t pins is possible 20 30 1 to dig output test output for melexis, debu g interface, unconnected in application mode - 3, 12, 13, 14, 15, 19, 22, 23, 24, 29, 31, 34, 37, 41, 46, 48 - not connected - not connected pins
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 6 of 23 tfr / 02.08.2013 rev 01 5 dig digital input or output or bidirectional ana analogue pin pwr power/supply pin multifunction multifunctional pin (configurable pin) test pin for test purposes lv low voltage, vdda or vddd related hv high voltage, vbat or vs related top view of the package qfn32 vdda lin ti1 rel1 9 gndh 10 rel2 11 12 13 14 15 16 gndd gnda key1 gndl 32 vddd 31 rtg 30 29 vs 28 ps 27 ad1 26 25 key0 top view of the package tqfp48 1 2 3 4 5 6 ti1 7 ti2 8 pwm1 pwm2 key7 key6 key5 sense2 osc1 key1 key2 key3 key4 sense1 MLX81150 to osc2 tc1 tc2 key0 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 n.c. n.c. n.c. n.c. n.c. table 2: pin out description
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 7 of 23 tfr / 02.08.2013 rev 01 5 3. electrical characteristics all voltages are referenced to ground (gnd). positi ve currents flow into the ic. the absolute maximum ratings given in the table below are limiting value s that do not lead to a permanent damage of the dev ice but exceeding any of these limits may do so. long term exposure to limiting values may affect the reliabil ity of the device. reliable operation of the MLX81150 is o nly specified within the limits shown in operating conditions. 3.1 operating conditions parameter symbol conditions min limit typ max unit supply voltage range vs 5.5 (3.9 [1] ) 18 v ambient temperature ta -40 105 (150 [2] ) c table 3: operational conditions the ic can have 6 different hardware modes. the exa ct functionality of these modes depends on the hardware and software configuration: reset: o triggered by hardware. when vs or vdda or vddd dro p below a critical level, the complete chip is powered down. o the analogue and digital supply regulators are dis abled. no functionality is available in this mode. normal mode. main application running o microcontroller fully functional o analogue fully functional power saving mode o application cpu halted o wake-up by interrupt possible under voltage: triggered by the hardware under vol tage detection interrupt. (vs_uv) o microcontroller fully functional. o analogue functionality under software control. o reduced current capability on vdda below vs=5.5v. over voltage: triggered by the hardware over volta ge detection interrupt. (vs_ov) o microcontroller fully functional o analogue functionality powered down by hardware or software. sleep mode: triggered by the software. o microcontroller powered down o digital and analogue supply powered down. o sleep mode and wake-up functionality running on he lp supply vaux [1] development target, ic will work down to 3.9v w ith reduced analogue characteristics, digital part still works, memories will keep their content. some analogue parameter will drift o ut of limits, but chip function can be guaranteed. before going down to 3.9v the vs has to be at the s tartup of the ic for a certain time > 6v to guarant ee a correct reset! evaluation will only be done on sample basis in the preproduction phase; no production test; no life t ime test [2] with temperature applications at ta>105c a red uction of chip internal power dissipation with an e xternal transistor in the voltage regulator path is obligatory. the extended temperature range is only allowed for a limited per iod of time, customers mission profile has to be agreed by melexis as an o bligatory part of the part submission warrant (psw) . some analogue parameter may drift out of limits, but chip functio n can be guaranteed.
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 8 of 23 tfr / 02.08.2013 rev 01 5 3.2 absolute maximum ratings parameter symbol condition limit min limit max unit t < 5 min -0.3 28 vs t < 500 ms -0.3 45 vs.tr1 iso 7637-2 pulse 1 [1] vs=13.5v, ta=(23 5)c -100 vs.tr2 iso 7637-2 pulse 2 [1] vs=13.5v, ta=(23 5)c +50 vs.tr3 iso 7637-2 pulses 3a, 3b [1] vs=13.5v, ta=(23 5)c -150 +100 supply voltage vs.tr5 iso 7637-2 pulses 5b [1] vs=13.5v, ta=(23 5)c +65 +87 output voltage vdda -0.3 3.6 output voltage vddd -0.3 1.95 lin bus vlin t < 500ms -22 40 vlin.tr1 iso 7637-2 pulse 1 [2] vs=13.5v, ta=(23 5)c 100 vlin.tr2 iso 7637-2 pulse 2 [2] vs=13.5v, ta=(23 5)c +75 vlin.tr3 iso 7637-2 pulses 3a, 3b [2] vs=13.5v, ta=(23 5)c -150 +100 without external resistor; pins key[7:0], ad1 pin pwm[2:1] -0.3 vs+0.3 v(ps) +0.3 vana_hv with external resistor of 47 k ? pins key[7:0], ad1 vbat vmaxps pin ps 15 vmaxsense [2:1] pins sense[2:1] vs+0.3 voltage on analogue hv vmaxrel[2:1] pins rel[2:1] 39 voltage on analogue lv vana_lv pins rtg, tc[2:1], osc[2:1] rtg (in case of external bipolar transistor) -0.3 vdda +0.3 5 digital output voltage vout_dig pin to -0.3 vdda +0.3 digital input voltage vin_dig pins ti[2:1] -0.3 vdd a +0.3 v digital input current iin_dig pins ti[2:1] -10 10 maximum latchCup free current at any pin ilatch according to jedec jesd78, aec-q100-004 -250 250 ma esd capability of pin lin esdhbm_lin human body model [7] -6 +6 kv esd capability of pin lin esdiec_lin acc. to iec 61000-4-2 [6] -6 +6 kv esd capability of any other pin, except lin esdhbm human body model [7] -2 +2 kv esd capability at any pin esdcdm charge device model -500 +500 v storage temperature tstg -55 150 c
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 9 of 23 tfr / 02.08.2013 rev 01 5 junction temperature tj -40 150 (155) [4][5] c thermal resistance qfn32 [3] rth in free air, air flow 0m/s ~ 32 k/w table 4: absolute maximum ratings [1] iso 7637 test pulses are applied to vs via a re verse polarity diode and >1f blocking capacitor; [2] iso 7637 test pulses are applied to lin via a c oupling capacitance of 1nf; [3] simulated value for low conductance board (jede c). [4] 150c ambient temperature is a target value. fo r temperatures >105c an external bipolar regulator transistor in the regulator path should be used. ambient temperatures of 150c are only allowed for limited periods of time to be agreed in a mission profile with the customer. [5] 155c is a development target value. [6] equivalent to discharging a 150pf capacitor thr ough a 330 ? resistor; [7] the specified values are a target to be verifie d on first prototypes. based on the evaluation resu lts, additional external protection components might be recommended to reach the specif ied system esd levels. [8] equivalent to discharging a 100pf capacitor thr ough a 1.5k ? resistor conform to mil std 883 method 3015.7.
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 10 of 23 tfr / 02.08.2013 rev 01 5 4. application examples the following sections show typical application exa mples [1] . [1] the application examples are principal applicat ion schematics only. the details need to be worked out for each application schematic separately, depending on the application requirements. 4.1 single dc motor drive in this sample application the ic can realize the d riving of a dc motor via an external relay bridge. speed, position sensing and anti trap or block detection a re done by means of external hall latches connected to a timer capture unit. the hall sensors are switched o ff during standby mode via a switchable battery vol tage output. additionally relay contact monitoring can d one by checking the voltages over it. vs vdda v bat key0 tc2 tc1 rel2 rel1 ps key1 key2 key3 key4 key5 ti1 ti2 to hall sensor m v bat key6 gndd ad1 vddd pwm1 pwm2 lin lin rtg sense1 sense2 key7 gndh osc2 osc1 gnda gndl gndcap gndcap figure 2 C principle application diagram showing a common relay driver controlled by external switches and lin bus
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 11 of 23 tfr / 02.08.2013 rev 01 5 4.2 single dc motor drive with soft start / stop for some applications it might be necessary: to control the motor speed especially during start / stop, to have an independent switching channel in case t he relay hangs, to switch the power via the power transistor and t o increase with this the life time of the relay contacts to monitor the motor current (current sensing and over current shut off). this application requires then also a reverse polar ity protection in the power path. following application diagram shows the practical r ealization in principle: figure 3 C principle application diagram showing a common relay driver controlled by external switches and lin bus, with soft start / stop and mo tor current sense
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 12 of 23 tfr / 02.08.2013 rev 01 5 4.3 single dc motor drive in fet controlled full br idge applications by adding some external additional circuitry, the i c will also allow to drive dc motors in full bridge applications. position, speed and direction sensing is done via external hall latches. by having one pwm on the low side path of the half bridge and the inverse pwm (with programmable interlock delay in the high side path) the p channe l can be actively switched on in case the current w heels out. same is for the n-channel transistor. the other side of the full bridge is then staticall y switched on or off. vs vdda v bat key0 gnda tc2 tc1 rel2 rel1 ps key1 key2 key3 key4 key5 ti1 ti2 to hall sensor v bat key6 gndd ad1 vddd pwm1 pwm2 lin lin rtg sense1 sense2 key7 gndh osc2 osc1 m gndl gndcap gndcap figure 4 C principle application diagram showing a dc motor in a full bridge application
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 13 of 23 tfr / 02.08.2013 rev 01 5 4.4 led-lamp driver, switch mode power supply in this application the MLX81150 drives a led lamp with several high power leds in a dc-dc converter configuration. the module itself is controlled via the lin bus. the current in the led is regulated to a given value. adjusting pwm frequency and pwm ratio allow to control the transformator in a very efficient wa y from emc perspective as well as from energy point o f view. figure 5 C principle application diagram showing a dc/dc converter for high power led lamp driving controlled by a lin bus
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 14 of 23 tfr / 02.08.2013 rev 01 5 4.5 MLX81150 in 1- and 2- phase bldc (brush less dc ) motor control applications bldc motors are used today in several permanent run ning automotive applications. 1- and 2-phase bldc motors are applied in several auxiliary application s as small pumps and blowers. in case these pumps request a lin or pwm interface connection, the mlx8 1150 is a perfect solution for that. the commutatio n information for the brush less dc motors is provide d by a hall switch/latch reacting on positive and n egative magnet field of the permanent magnet rotor. figure 6 C principle application diagram showing a 1 / 2 phase bldc motor drive
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 15 of 23 tfr / 02.08.2013 rev 01 5 4.6 higher vdda loads or higher ambient temperature s if it is necessary to supply higher currents to ext ernal 3.3v loads or if high ambient temperatures >105c are requested, it is possible to connect to the rtg pin an external load transistor. this exter nal load transistor provides a higher current for possible e xternal devices and also decreases the internal pow er dissipation. v bat vs vdda vddd rtg gndcap gnda gndd gndl gndcap figure 7 C principle application diagram in case of higher vdda loads or if high ambient temperatures are applied 4.7 use of external resonator it is possible to use an external resonator in case a higher precision of the frequency is requested. figure 8 C principle application diagram using an e xternal resonator
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 16 of 23 tfr / 02.08.2013 rev 01 5 4.8 key inputs with different wetting currents in a ctive and sleep configuration depending on different application requests for the key inputs it might be necessary to use in active mode relatively high wetting currents for the external s witches. these currents will be provided by externa l pull up / pull down resistors. the ic will read the switches then with suitable threshold levels. in sleep mode relatively low wetting currents might be necessary. these currents will also be provided by external pull up / pull down resistors. wake up wil l be then just with a rising or falling edge of the incoming signal. an external bipolar transistor will just se lect the suitable series resistor for active mode o r sleep mode. vs vdda v bat key0 key1 key2 key3 key4 key5 key6 ad1 vddd rtg key7 pwm1 gndcap figure 9 C principle application diagram using diff erent wetting currents in active and sleep mode configuration, switches are related to gnd; pwm1 pi n provides steady state voltage level, pull up currents
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 17 of 23 tfr / 02.08.2013 rev 01 5 vs vdda v bat key0 key1 key2 key3 key4 key5 key6 ad1 vddd rtg key7 pwm1 gndcap figure 10 C principle application diagram using dif ferent wetting currents in active and sleep mode configuration, switches are related to supply; pwm1 pin provides steady state voltage level, pull down currents
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 18 of 23 tfr / 02.08.2013 rev 01 5 via a 2-stage measurement, first at pin ad1 to chec k the v bat and second at pin key7, it is possible to check also the status of so called matrix switches vs vdda v bat ad1 vddd rtg key7 rprot = 47kw rprot = 47kw r2 r3 sw1 sw2 sw3 r1 rser gndcap figure 11 C principle application diagram with matr ix switch detection via key7 and ad1
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 19 of 23 tfr / 02.08.2013 rev 01 5 5. mechanical specification 5.1 package data qfn32 (5x5, 32 leads) [1][2] a a1 a3 b d d2 e e2 e l n[3] nd [4] ne[4] min 0.80 0.00 0.18 3.50 3.50 0.3 nom 0.85 0.02 0.25 3.60 3.60 0.4 max 1.00 0.05 0.20 0.30 5.00 3.70 5.00 3.70 0.50 0.5 32 8 8 table 5: mechanical dimensions qfn32 5x5 [1] dimensions and tolerances conform to asme y14.5 m-1994 [2] all dimensions are in millimeters. all angels a re in degrees [3] n is the total number of terminals [4] nd and ne refer to the number of terminals on e ach d and e side respectively e d + d2/2 d2 b 0.20 min. l e (nd-1)xe ref. 12 3 12 3 e2/2 e2 (ne-1)xe ref. pin1 id 0.20 r a1 a top view bottom view side view a3 figure 12: package data qfn32
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 20 of 23 tfr / 02.08.2013 rev 01 5 5.2 package data tqfpep 48l (7x7, 48 leads) a a1 a2 b b1 d d1 d2 e e1 e2 e l n ccc ddd min - 0.05 0.95 0.17 0.17 0.45 - - nom - - 1.00 0.22 0.20 0.60 - - max 1.20 0.15 1.05 0.27 0.23 9.00 7.00 4.00 9.00 7.00 4.00 0.50 0.75 48 0.08 0.08 table 6: mechanical dimensions tqfpep(48) 7x7 notes: 1. all dimensioning and tolerances conform to asme y14.5m-1994, ?2. datum plane [-|-|-] located at mould parting li ne and coincident with lead, where lead exists, pla stic body at bottom of parting line. ?3. datum [a-b] and [-d-] to be determined at centr eline between leads where leads exist, plastic body at datum plane [-|-|-] ?4. to be determined at seating plane [-c-] ?5. dimensions d1 and e1 do not include mould protr usion. dimensions d1 and e1 do not include mould pr otrusion. allowable mould protrusion is 0.254 mm on d1 and e1 dimensions. 6. 'n' is the total number of terminals ?7. these dimensions to be determined at datum plan e [-|-|-] 8. package top dimensions are smaller than bottom d imensions and top of package will not overhang bott om of package. ?9. dimension b does not include dam bar protrusion , allowable dam bar protrusion shall be 0.08mm tota l in excess of the "b" dimension at maximum materia l condition, dam bar can not be located on the lower radius of the foot. 10. controlling dimension millimeter. 11. maximum allowable die thickness to be assembled in this package family is 0.38mm 12. this outline conforms to jedec publication 95 r egistration ms-026, variation aba, abc & abd. ?13. a1 is defined as the distance from the seating plane to the lowest point of the package body. ?14. dimension d2 and e2 represent the size of the exposed pad. the actual dimensions are specified io n the bonding diagram, and are independent from die size. 15. exposed pad shall be coplanar with bottom of pa ckage within 0.05. exposed pad need best possible contact to ground for exlectrical and thermal reasons figure 13: package data tqfpep48
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 21 of 23 tfr / 02.08.2013 rev 01 5 6. marking/order code 6.1 marking MLX81150 1 figure 14: marking example on ic package qfn32 5x5 package 1 figure 15: marking example on ic package tqfp ep 7x 7 package 6.2 order code MLX81150
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 22 of 23 tfr / 02.08.2013 rev 01 5 7. assembly information our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test metho ds: reflow soldering smds (s urface m ount d evices) ipc/jedec j-std-020 moisture/reflow sensitivity classification for nonh ermetic solid state surface mount devices (classification reflow profiles according to table 5-2) eia/jedec jesd22-a113 preconditioning of nonhermetic surface mount device s prior to reliability testing (reflow profiles according to table 2) wave soldering smds (s urface m ount d evices) and thds (t hrough h ole d evices) en60749-20 resistance of plastic- encapsulated smds to combin ed effect of moisture and soldering heat eia/jedec jesd22-b106 and en60749-15 resistance to soldering temperature for through-hol e mounted devices iron soldering thds (t hrough h ole d evices) en60749-15 resistance to soldering temperature for through-hol e mounted devices solderability smds (s urface m ount d evices) and thds (t hrough h ole d evices) eia/jedec jesd22-b102 and en60749-21 solderability for all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature prof ile etc) additional classification and qualificatio n tests have to be agreed upon with melexis. the application of wave soldering for smds is allo wed only after consulting melexis regarding assuran ce of adhesive strength between device and board. melexis recommends reviewing on our web site the ge neral guidelines soldering recommendation ( http://www.melexis.com/quality_soldering.aspx ) as well as trim&form recommendations ( http://www.melexis.com/assets/trim-and-form-recomme ndations-5565.aspx ). melexis is contributing to global environmental con servation by promoting lead free solutions. for more information on qualifications of rohs compliant products (rohs = european directive on t he restriction of the use of certain hazardous substances) please vis it the quality page on our website: http://www.melexis.com/quality.aspx
MLX81150 lin-slave for relay and dc motor control MLX81150 C product abstract page 23 of 23 tfr / 02.08.2013 rev 01 5 8. disclaimer the product abstract just provides an overview of t he described devices. please consult the complete product specification/datasheet in its latest revis ion for any detailed information. devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, s tatutory, implied, or by description regarding the information set forth herein or regarding the freed om of the described devices from patent infringemen t. melexis reserves the right to change specifications and prices at any time and without notice. therefo re, prior to designing this product into a system, it i s necessary to check with melexis for current infor mation. this product is intended for use in normal commerci al applications. applications requiring extended temperature range, unusual environmental requiremen ts, or high reliability applications, such as milit ary, medical life-support or life-sustaining equipment a re specifically not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, melexis shall no t be liable to recipient or any third party for any dama ges, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequ ential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the t echnical data herein. no obligation or liability to recipien t or any third party shall arise or flow out of mel exis rendering of technical or other services. ? 2012 melexis nv. all rights reserved. for the latest version of this document go to our w ebsite at www.melexis.com or for additional information contact melexis direc t: europe and japan: all other locations: phone: +32 1367 0495 phone: +1 603 223 2362 e-mail: sales_europe@melexis.com e-mail: sales_usa @melexis.com iso/ts16949 and iso14001 certified

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